Modules 9 & 10 - CMOS Inverter Characteristics (Dynamic) and Power-Energy

7.3: Dynamic Behavior of CMOS Inverter

The values of VH,VL don't affect CMOS power delay, but are primarily affected by other parameters like τP, the propogation delay of the inverter.

7.3.1: Propagation Delay Estimate

We look to estimate the propogation delay using our capacitance approximation:

Pasted image 20240211234445.png

Pasted image 20240211234519.png

These conditions are the same conditions we used to determine τPHL for the NMOS resistor with a resistive load. Using the equations from Modules 7 & 8 - MOSFET Layout and Capacitances, NMOS inverter-dynamic characteristics#^adda20, we can say that:

τPHL=1.2RonNC,RonN=1Kn(VHVtn)

for a CMOS where VH=2.5V and Vtn=0.6V then:

τPHL=0.63CKn

a similar analysis on the other state gives that:

τPLH=1.2RonPC,RonP=1Kp(VH+Vtp)τPLH=0.63CKp

Notice that since KP<Kn often, then we have that τPHL>τPLH. Hence, we usually use our smallest design where W/L=2/1 so then (W/L)N=2/1 while say (W/L)P=5/1 or something similar.

Thus only when τPLH=τPHL (which is ideal in most circumstances), then:

τP=τPHL+τPLH2=1.2RonNC

7.3.2: Rise and Fall Times

Use the same table from Modules 7 & 8 - MOSFET Layout and Capacitances, NMOS inverter-dynamic characteristics#^adda20, we get:

tf=3τPHL,tr=3τPLH

7.3.3: Performance Scaling

When we change some capacitance or W/L for a CMOS, we have to consider the change in τP or similar:

(W/L)=(W/L)×τPrefτP×CLCLref

where all the ref values are our initial values, and anything with a indicates a change to a new variable.

7.3.4: Delay of Cascaded Inverters

Consider:

Pasted image 20240211235821.png

Here the first inverter acts as expected, but for the delay times for the other 4 inverters are significantly slower:

τPHL2.4RonNC,RonN=1Kn(VDDVtn)τPLH2.4RonPC,RonP=1Kp(VDD+Vtp)tr=2τPLH,tf=2τPHL

thus, when inverters are stacked like this we expect just two propagation delays total (doubled τP).

7.4: Power Dissipation and Power Delay Product in CMOS

7.4.1: Static Power Dissipation

CMOS's have zero static-power dissipation, as they only drain power when switching (when idle, no power is lost). But in low power or high performance designs, static power is huge.

One way to deal with this is via:

Pasted image 20240211233139.png

The MSA and MSB control the power to logic blocks, where power to inactive blocks can be controlled via software or hardware control.

7.4.2: Dynamic Power Dissipation

As the gate charges and discharges load capacitance C at frequency f, the power dissipation is equal to:

PD=CVDD2f

Usually PD is the largest component of power dissipation in CMOS gates at high enough frequencies. See 6.10 for specifics on where this equation comes from.

Pasted image 20240211233640.png

Here in 7.17 we see how, because of finite time in switching speed, we get a power loss (P=IV) from the time the CMOS switches. If we have a fast enough frequency, we see that the time plot we get has closer peaks (and more multiples of them).

7.4.3: Power Delay Product

We defined the power-delay product before in Modules 1 & 2 - NMOS Review#^86a3c7:

PDP=PavτP

here Pav=PD=CVDD2f. But f=1/T is related to the rise and fall times of our CMOS:

Ttr+ta+tf+tb

as seen in Figure 7.18. For the highest possible switching frequency we have ta,tb0 and the rise and fall times are the greater proportion (80%) of total transition time. Assuming tr=tf then:

T2tr0.8=2(τP)0.8=5τP

a lower bound on the power-delay product for CMOS is:

PDPCVDD25τPτP=CVDD25

thus for better power we want to reduce C, but more so importantly VDD when possible.